The LDAC workshop series provides a focused overview on technical and applied research on the usage of semantic web, linked data and web of data technologies for architecture and construction (design, engineering, construction, operation, etc.). It aims at bringing together researchers, industry stakeholders, and standardization bodies of the Linked Building Data (LBD) community together. The aim of the workshop is to present current developments, coordinate efforts, gather stakeholders, use cases and plan future activities.
The topic of the 2016 event is how to use the semantic web technologies for building information management in diverse practical use cases. These use cases can deploy a number of concepts and approaches around the use of semantics in Building Information Modelling, including, but not limited to:
The LDAC 2016 event provides an opportunity to present and openly discuss these use cases.
Submission deadline: May 6, 2016
Notification of acceptance: May 13, 2016
Registration: May 20, 2016
LDAC workshop: June 21-22, 2016
Submit a 2-pager position statement (about 800 words) before the submission deadline (6 May 2016), including the following:
Please submit your PDF file with the above mentioned content directly via email to: ldac16@delicias.dia.fi.upm.es
If you are willing to support this event contat us at ldac16@delicias.dia.fi.upm.es
The workshop is open to all practitioners and researchers interested in the application of Linked Data technologies in the architecture and construction field.
Participants should register to the workshop through the following link. The deadline for registrations is May 20, 2016.
The workshop event itself is free. Lunch and coffee are provided by the organization. Dinners are on your own expenses, but we will make a group reservation in a nice restaurant for those interested.
The event will be held at the Escuela Técnica Superior de Ingenieros en Informática, Calle Ciruelos 2, Boadilla del Monte, Madrid, Spain.
Please see attached documents on how to reach ETSIInf at UPM.